Merging Mechanical and Electrical Design

The CU500 is a versatile robotic tool that combines 5-axis 3D printing, embedded wiring and printed electronics.

This robotic tool is able to switch heads (end-effectors) so that it can add polymer, printed electronics, wires and surface mounted components to create complex, functional structures – Additive Interconnect Devices (AID). An AID is a part made using additive methods with integrated electronic circuit traces, similar to a Moulded Interconnect Device (MID).

5-axis Fused Filament Fabrication

  • Able to create polymer structures with smooth curved surfaces.
  • Printing 5 – 10 times faster for complex structures compared to existing FFF printers.
  • Can align the laminations to create much stronger components.

Printed Electronics

  • The smooth polymer surfaces that the 5-axis additive manufacturing head can create are ideal for creating 3D conductive tracks.
  • Using a laser head to cure and sinter the metal paste, creates printed electronics with world class conductivity.

Embedded Filaments and Wires

  • Embedding wires into the polymer can make 3D structures capable of power applications as well as data.
  • It is possible to embed fibre-optic sensors and multi-mode data fibres using the Q5D tool.
  • It is possible to precisely add carbon or glass fibre reinforcement to a part to give local strength to a polymer component.
 

CU700 5-axis Platform

Axis
Bed
Z : 840 mm
C : n * 360°
 
End-Effector
X : 1250 mm
Y : 870 mm
B : 230°
Tool Changer
Automated tool changer
Space for 3 end-effectors (more with a carousel)
  
Build Chamber (L x W x H)
700 mm (Ø) x 500 mm (H) (at all angles of attack)
1000 mm (X) x 800 mm (Y) x 600 mm (Z)
  
Positional accuracy
< 50 μm
  
Head Speed
300 mm/s
  
Platform Size
1.67 m (D) x 1.34 m (W) x 2.06 m (H)
  
Weight
900 kg
  
Power
13 amps (max.)
  
Payload
50kg
  

FFF Head
Print Technology
Fused Filament Fabrication (FFF)
Single or dual Material
Materials
PEEK, ULTEM, ABS, PETG, Nylong, glass and carbon filled materials and many others
Nozzle Diameters
0.2 mm to 1.2 mm
Speed
60 mm/s

Thick Paste Extruder

  
Nozzle Diameters
0.2 mm to 1.2 mm
Materials
Silver Paste, Copper paste, ceramic, UV adhesives, epoxy resins, acrylate, silicone, grease, inks, waxes, bio-technical suspensions, abrasive pastes and others

Jetting Head
Orifice Diameter
50 μm – 600 μm
Materials
Silver Paste
Drop Size
Micro-droplets as small as 0.6 nL
Jet Speed
Dispenses at 1000 Hz in continuous mode and up to 1500 Hz in burst mode

Wire Embedding Tool
Nozzle Diameters
0.2 mm to 1.2 mm
Materials
Silver Paste, Copper paste, ceramic, UV adhesives, epoxy resins, acrylate, silicone, grease, inks, waxes, bio-technical suspensions, abrasive pastes and others

Laser Sintering
Materials
Silver and copper paste
Track thickness
1 μm to 30 μm
Conductivity
30% to 50% of the metal used in the ink
Column 1 Value 5 Column 2 Value 5