Merging Mechanical and Electrical Design
The CU500 is a versatile robotic tool that combines 5-axis 3D printing, embedded wiring and printed electronics.
This robotic tool is able to switch heads (end-effectors) so that it can add polymer, printed electronics, wires and surface mounted components to create complex, functional structures.
5-axis Fused Filament Fabrication
- Able to create polymer structures with smooth curved surfaces.
- Printing 5 – 10 times faster for complex structures compared to existing FFF printers.
- Can align the laminations to create much stronger components.
Printed Electronics
- The smooth polymer surfaces that the 5-axis additive manufacturing head can create are ideal for creating 3D conductive tracks.
- Using a laser head to cure and sinter the metal paste, creates printed electronics with world class conductivity.
Embedded Filaments and Wires
- Embedding wires into the polymer can make 3D structures capable of power applications as well as data.
- It is possible to embed fibre-optic sensors and multi-mode data fibres using the Q5D tool.
- It is possible to precisely add carbon or glass fibre reinforcement to a part to give local strength to a polymer component.

CY700 5-axis Platform
Axis |
Bed |
Z : 840 mmC : n * 360° |
End-Effector |
X : 1250 mmY : 870 mmB : 230° |
|
Tool Changer |
Automated tool changerSpace for 3 end-effectors (more with a carousel) |
|
Build Chamber (L x W x H) |
Cylindrical 700 mm (Ø) x 500 mm (H) (at all angles of attack)1000 mm (X) x 800 mm (Y) x 600 mm (Z) |
|
Positional accuracy |
< 50 μm |
|
Head Speed |
300 mm/s |
|
Platform Size |
1.67 m (D) x 1.34 m (W) x 2.06 m (H) |
|
Weight |
900 kg |
|
Power |
13 amps (max.) |
|
Payload |
50kg |
FFF Head |
|
Print Technology |
Fused Filament Fabrication (FFF)Single or dual Material |
Materials |
PEEK, ULTEM, ABS, PETG, Nylong, glass and carbon filled materials and many others |
Nozzle Diameters |
0.2 mm to 1.2 mm |
Speed |
60 mm/s |
Thick Paste Extruder |
|
Nozzle Diameters |
0.2 mm to 1.2 mm |
Materials |
Silver Paste, Copper paste, ceramic, UV adhesives, epoxy resins, acrylate, silicone, grease, inks, waxes, bio-technical suspensions, abrasive pastes and others |
Jetting Head |
|
Orifice Diameter |
50 μm – 600 μm |
Materials |
Silver Paste |
Drop Size |
Micro-droplets as small as 0.6 nL |
Jet Speed |
Dispenses at 1000 Hz in continuous mode and up to 1500 Hz in burst mode |

Wire Embedding Tool |
|
Nozzle Diameters |
0.2 mm to 1.2 mm |
Materials |
Silver Paste, Copper paste, ceramic, UV adhesives, epoxy resins, acrylate, silicone, grease, inks, waxes, bio-technical suspensions, abrasive pastes and others |
Laser Sintering |
|
Materials |
Silver and copper paste |
Track thickness |
1 μm to 30 μm |
Conductivity |
30% to 50% of the metal used in the ink |