If you have picked up on this Blog then chances are you already know about Laser Direct Structuring (LDS), it has been around for a while, and was commercialised by LKPF some 20 years ago. But I am guessing 5-axis Laser Sintered Printing is probably a mystery to you. The laser sintering process was pioneered by M-Solv, where they call it One-Step Metallisation (OSM) and use it for adding conductive tracks to glass and sheet polymers for applications like capacitive touch sensors. Q5D Technology has taken this process and adapted it for their 5-axis platform so that it can be used to create three-dimensional structures, very similar to those made with LDS. Since there are never enough TLAs in the world (Three Letter Abbreviations) Q5D have coined the phrase LSP-5, 5-axis Laser Sintered Printing.
Both techniques are a way of creating high quality conductive tracks on a polymer substrate that has a complicated three-dimensional shape. LDS has found a market making moulded interconnect devices (MIDs), embedded antennas, compact LED lighting, medical devices, or electromechanical products such as keys or electrical terminations.